Tungsten(W)

 

・Hard

・Spring property available

・For AI pad

・Tip diameter lineup
1μm, 2μm, 5μm,
10μm, 30μm

 

Beryllium copper(BeCu)

 

・Soft

・Contact resistance value
is low

・Ideal for gold pads

 

Palladium (Pd)

 

・Soft

・Contact resistance value is low

・For high current

・It also fits gold pads

 

Iridium (Ir)

 

Hard

・Contact resistance value is low

・For high current

・High permissible current value

・Stability of surface condition